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IDV30E65D2XKSA1 - Infineon

Description: Infineon Switching Diode, 650V 30A, 73ns, 2-Pin TO-220FP

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PCB Footprints
IDV30E65D2XKSA1 - Infineon PCB footprint - Other - Other - PG-TO220-2
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3D Models
IDV30E65D2XKSA1 - Infineon  - 3D model - Other - PG-TO220-2
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IDV30E65D2XKSA1 Details

  • Manufacturer Part Number:

    IDV30E65D2XKSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Additional Feature:

    PD-CASE

  • Application:

    FAST SOFT RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.2 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    180 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    47 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    40 µA

  • Reverse Recovery Time-Max:

    0.07 µs

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

IDV30E65D2XKSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a dedicated application note (AN2014-01) that outlines the recommended PCB layout and thermal management guidelines for the IDV30E65D2XKSA1. It's essential to follow these guidelines to ensure optimal performance, reliability, and thermal dissipation.
  • Infineon recommends using a gate driver that meets the module's specific requirements, such as the 1EDC60N12AH or 1EDC60N12AS. The gate driver selection depends on factors like the IGBT's gate-emitter voltage, switching frequency, and power rating. Consult Infineon's application notes and gate driver selection guides for more information.
  • The IDV30E65D2XKSA1's SOA is not explicitly stated in the datasheet. However, Infineon provides a dedicated SOA application note (AN2019-03) that outlines the SOA limitations for this module. It's crucial to understand and respect these limitations to prevent device damage and ensure reliable operation.
  • Infineon recommends using a dedicated overcurrent protection IC, such as the TLE4961 or TLE4962, which can detect overcurrent conditions and provide a fault signal to the system controller. The protection IC should be configured according to the module's specific requirements and the system's operating conditions.
  • Infineon provides a dedicated soldering and assembly guide (AN2015-01) that outlines the recommended procedures for soldering and assembling the IDV30E65D2XKSA1. It's essential to follow these guidelines to ensure reliable connections and prevent damage to the module.

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IDV30E65D2XKSA1 Overview

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