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IDW30E60FKSA1 - Infineon

Description: Diodes - General Purpose, Power, Switching IGBT PRODUCTS

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PCB Footprints
IDW30E60FKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO 247-3
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3D Models
IDW30E60FKSA1 - Infineon  - 3D model - Transistor Outline, Vertical - PG-TO 247-3
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IDW30E60FKSA1 Details

  • Manufacturer Part Number:

    IDW30E60FKSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Additional Feature:

    PD-CASE

  • Application:

    FAST SOFT RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    60 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    143 W

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    40 µA

  • Reverse Recovery Time-Max:

    0.143 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

IDW30E60FKSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN-1165, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • Infineon recommends using a gate driver with a minimum output current of 2A and a maximum output voltage of 20V to ensure reliable operation. The driver should also be able to handle the module's input capacitance of 10nF.
  • The IDW30E60FKSA1 has an internal overcurrent protection (OCP) feature that trips at 60A. The module also has a short-circuit protection (SCP) feature that trips at 10μs. These protections are designed to prevent damage to the module in case of overcurrent or short-circuit conditions.
  • Infineon recommends following the guidelines in their application note AN-1166 for EMC design considerations, including proper PCB layout, shielding, and filtering to minimize electromagnetic interference (EMI).
  • Infineon recommends using a forced-air cooling system or a liquid cooling system with a minimum flow rate of 1L/min to ensure reliable operation at high power levels. The cooling system should be designed to maintain a maximum junction temperature of 150°C.

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IDW30E60FKSA1 Overview

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