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IDW40G65C5BXKSA2 - Infineon

Description: Schottky Diodes & Rectifiers SIC DIODES

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PCB Footprints
IDW40G65C5BXKSA2 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO247-3_a
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3D Models
IDW40G65C5BXKSA2 - Infineon  - 3D model - Transistor Outline, Vertical - PG-TO247-3_a
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IDW40G65C5BXKSA2 Details

  • Manufacturer Part Number:

    IDW40G65C5BXKSA2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    PD-CASE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    650 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    87 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    112 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    210 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

IDW40G65C5BXKSA2 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (Tj) and adjust the operating conditions accordingly.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure reliable operation.
  • Use a gate driver with a high current capability and a low output impedance. Ensure the gate driver is compatible with the device's gate-source voltage (Vgs) and gate-drain voltage (Vgd) ratings.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Ensure the PCB design includes ESD protection features such as guard rings and ESD-safe handling procedures.

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IDW40G65C5BXKSA2 Overview

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Part Image IDW40G65C5B Infineon Technologies AG

Rectifier Diode, Schottky, 1 Phase, 2 Element, 20A, 650V V(RRM), Silicon Carbide, TO-247

Part Image IDW40G65C5BXKSA1 Infineon Technologies AG

Rectifier Diode, Schottky, 1 Phase, 2 Element, 650V V(RRM), Silicon Carbide, TO-247