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IDW40G65C5XKSA1 - Infineon

Description: Schottky Diodes & Rectifiers SIC DIODES

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Symbol
IDW40G65C5XKSA1 - Infineon - PCB symbol
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PCB Footprints
IDW40G65C5XKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO 247-3
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3D Models
IDW40G65C5XKSA1 - Infineon - 3D model - Transistor Outline, Vertical - PG-TO 247-3
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IDW40G65C5XKSA1 Details

  • Manufacturer Part Number:

    IDW40G65C5XKSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Additional Feature:

    PD-CASE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    650 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    182 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    40 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    183 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    220 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

IDW40G65C5XKSA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to ensure efficient heat dissipation.
  • Ensure proper thermal design, use a heat sink or thermal pad, and follow the recommended PCB layout. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Monitor the device's junction temperature (TJ), drain-source voltage (VDS), and drain current (ID) to detect potential faults and ensure reliable operation.
  • Use a gate driver with a high current capability (> 1A) and a low output impedance (< 10 ohms) to ensure fast switching times and minimize ringing. Also, consider using a gate resistor (RG) to adjust the gate voltage slope.
  • Use ESD protection devices (e.g., TVS diodes) on the input and output pins, and ensure that the PCB design includes ESD protection features such as guard rings and ESD-safe layout practices.

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IDW40G65C5XKSA1 Overview

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