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IFSC1008ABERR47M01 - Vishay

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IFSC1008ABERR47M01 - Vishay  - 3D model
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IFSC1008ABERR47M01 Details

  • Manufacturer Part Number:

    IFSC1008ABERR47M01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.4

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • DC Resistance:

    0.029 Ω

  • Inductance-Nom (L):

    0.47 µH

  • Inductor Application:

    HIGH CURRENT INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Rated Current-Max:

    3.33 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IFSC1008ABERR47M01 Frequently Asked Questions (FAQs)

  • A symmetrical layout with a solid ground plane and minimal signal trace length is recommended. The datasheet provides a recommended PCB layout, but it's essential to consult with a PCB design expert to ensure optimal performance.
  • The device has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using thermal vias and a heat sink if necessary. Consult the datasheet for thermal resistance values.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. Avoid wave soldering, and ensure the PCB is designed for reflow soldering. Consult the datasheet for detailed soldering guidelines.
  • Consult the datasheet for troubleshooting guidelines. Common issues include incorrect PCB layout, thermal management, or soldering defects. Use oscilloscopes and signal analyzers to diagnose signal integrity issues.
  • Handle the device with ESD-protective equipment and follow standard ESD handling procedures. The device has built-in ESD protection, but it's not a substitute for proper handling and storage procedures.

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IFSC1008ABERR47M01 Overview

Use the download button to access the IFSC1008ABERR47M01 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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