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IFX91041EJV50XUMA1 - Infineon

Description: Infineon IFX91041EJV50XUMA1, 1-Channel, Step Down Buck Converter 8-Pin, DSO

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IFX91041EJV50XUMA1 Details

  • Manufacturer Part Number:

    IFX91041EJV50XUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, MS-012BA, SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3.6 A

  • Output Voltage-Max:

    16 V

  • Output Voltage-Min:

    0.6 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    420 kHz

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

IFX91041EJV50XUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling capabilities at high temperatures.
  • Monitor the device's temperature, current, and voltage. Implement over-temperature protection (OTP), over-current protection (OCP), and under-voltage lockout (UVLO) to prevent damage and ensure safe operation.
  • Consult the application notes and reference designs provided by Infineon. Optimize the PCB layout, component selection, and thermal design for your specific use case. Consider consulting with an experienced engineer or seeking support from Infineon's technical support team.
  • Follow the recommended soldering profile and assembly guidelines provided in the datasheet. Use a soldering iron with a temperature range of 220°C to 250°C, and ensure the device is handled by trained personnel to prevent damage.

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IFX91041EJV50XUMA1 Overview

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