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IGCM04F60GAXKMA1 - Infineon

Description: Motor / Motion / Ignition Controllers & Drivers CIPOS MINI

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PCB Footprints
IGCM04F60GAXKMA1 - Infineon PCB footprint - Other - Other - IGCM10F60GA-2
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3D Models
IGCM04F60GAXKMA1 - Infineon  - 3D model - Other - IGCM10F60GA-2
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IGCM04F60GAXKMA1 Details

  • Manufacturer Part Number:

    IGCM04F60GAXKMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    DIP-24

  • Country Of Origin:

    Malaysia, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDMA-T24

  • Length:

    36 mm

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    5.6 mm

  • Supply Current-Max (Isup):

    0.9 mA

  • Supply Voltage-Max (Vsup):

    18.5 V

  • Supply Voltage-Min (Vsup):

    14 V

  • Supply Voltage-Nom (Vsup):

    16 V

  • Surface Mount:

    NO

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Width:

    21 mm

IGCM04F60GAXKMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature of the IGCM04F60GAXKMA1 is 150°C, as specified in the datasheet. However, it's recommended to operate the module within a temperature range of 25°C to 125°C for optimal performance and reliability.
  • To ensure proper thermal management, it's essential to provide adequate heat sinking and cooling for the module. This can be achieved by using a heat sink with a thermal resistance of ≤ 0.5 K/W, and ensuring good thermal contact between the module and the heat sink. Additionally, the module should be operated within the recommended temperature range to prevent overheating.
  • The recommended gate resistance for the IGCM04F60GAXKMA1 is between 10 Ω and 100 Ω. A higher gate resistance can lead to slower switching times, while a lower gate resistance can cause excessive gate current and power losses.
  • Yes, the IGCM04F60GAXKMA1 can be used in a parallel configuration to increase the current handling capability. However, it's essential to ensure that the modules are properly matched and synchronized to prevent uneven current sharing and potential damage to the modules.
  • The recommended dead time for the IGCM04F60GAXKMA1 is typically in the range of 1-2 μs. This ensures that the IGBTs are fully turned off before the diodes are turned on, preventing cross-conduction and reducing power losses.

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IGCM04F60GAXKMA1 Overview

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