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IH0512S-H - XP POWER

Description: XP POWER - IH0512S-H - Isolated Board Mount DC/DC Converter, SIP, Through Hole, Fixed, 5.5 V, 4.5 V, 2 RoHS Compliant: Yes

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PCB Footprints
IH0512S-H - XP POWER PCB footprint - Other - Other - IH0512S-H-3
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3D Models
IH0512S-H - XP POWER  - 3D model - Other - IH0512S-H-3
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IH0512S-H Details

  • Manufacturer Part Number:

    IH0512S-H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMA, SIP5/7,.28

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    XP Power

  • YTEOL:

    6

  • Additional Feature:

    LG-MAX, WD-MAX

  • Analog IC - Other Type:

    DC-DC UNREGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-XSMA-T5

  • Length:

    19.81 mm

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.084 A

  • Output Voltage-Max:

    12.6 V

  • Output Voltage-Min:

    11.4 V

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SMA

  • Package Equivalence Code:

    SIP5/7,.28

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    10.16 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    2 W

  • Trim/Adjustable Output:

    NO

  • Width:

    7.62 mm

IH0512S-H Frequently Asked Questions (FAQs)

  • XP Power recommends a PCB layout with a solid ground plane and a thermal pad connected to a heat sink or a metal plate to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, ensure good airflow around the module to prevent overheating.
  • To ensure EMC, XP Power recommends following the layout and grounding guidelines in the datasheet. Additionally, use a metal enclosure, and ensure that all cables and connectors are properly shielded and filtered. It's also recommended to perform EMC testing to ensure compliance with relevant standards.
  • The derating curve for the IH0512SH is typically provided in the datasheet or can be obtained from XP Power's application notes. The derating curve shows the reduction in output power as a function of temperature, altitude, and input voltage. Engineers should consult the derating curve to ensure the module operates within its specified limits and to determine the maximum output power available under specific operating conditions.
  • The IH0512SH is designed to meet the requirements of IEC 60950-1 and UL 60950-1, which include vibration and shock testing. However, for extreme vibration or shock environments, XP Power recommends consulting their application notes or contacting their technical support for guidance on additional mechanical considerations, such as mounting and securing the module.
  • XP Power provides troubleshooting guides and application notes that cover common issues and their solutions. Engineers can also contact XP Power's technical support for assistance. In general, troubleshooting involves checking the input voltage, output load, and thermal management, as well as verifying the module's configuration and installation.

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IH0512S-H Overview

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