IHDM1107BBEV8R2M30 footprint, schematic symbol and 3D model by Vishay

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IHDM1107BBEV8R2M30 Details

Vishay recommends a PCB layout with a solid copper plane on the bottom layer, connected to the thermal pad of the IHDM1107BBEV8R2M30, to ensure optimal thermal performance. A minimum of 2 oz copper thickness is recommended.
To ensure reliable soldering, Vishay recommends using a soldering profile with a peak temperature of 260°C (500°F) for 10-15 seconds, and a soldering iron with a temperature range of 220-240°C (428-464°F).
Vishay recommends derating the maximum voltage by 10-15% to ensure reliable operation and to account for voltage spikes and transients.
To prevent damage, Vishay recommends storing the IHDM1107BBEV8R2M30 in its original packaging, away from direct sunlight, moisture, and extreme temperatures. During shipping, the devices should be protected from mechanical stress and electrostatic discharge.
Vishay recommends using ESD protection devices with a human body model (HBM) rating of 2 kV or higher to protect the IHDM1107BBEV8R2M30 from electrostatic discharge.

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