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IHLP1212BZER3R3M11 - Vishay

Description: VISHAY - IHLP1212BZER3R3M11 - INDUCTOR, 3.3UH 20%, IHLP-1212BZ-11

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Symbol
IHLP1212BZER3R3M11 - Vishay - PCB symbol
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PCB Footprints
IHLP1212BZER3R3M11 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - ER 2mm thickness
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3D Models
IHLP1212BZER3R3M11 - Vishay - 3D model - Inductors Precision Moulded - ER 2mm thickness
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IHLP1212BZER3R3M11 Details

  • Manufacturer Part Number:

    IHLP1212BZER3R3M11

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Case/Size Code:

    1212

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.061 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2 mm

  • Package Length:

    3 mm

  • Package Style:

    SMT

  • Package Width:

    3 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    2.7 A

  • Self Resonance Frequency:

    45 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Pure Matte Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP1212BZER3R3M11 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the IHLP1212BZER3R3M11 is a rectangular pad with a size of 3.3 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape.
  • The IHLP1212BZER3R3M11 is a moisture-sensitive device. It is recommended to store the components in a dry environment, and to follow the recommended baking and drying procedures before reflow soldering.
  • The maximum operating temperature range for the IHLP1212BZER3R3M11 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
  • The self-resonant frequency of the IHLP1212BZER3R3M11 can be calculated using the formula: f_res = 1 / (2 * π * sqrt(L * C)), where L is the inductance and C is the parasitic capacitance.
  • The recommended reflow soldering profile for the IHLP1212BZER3R3M11 is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C.

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IHLP1212BZER3R3M11 Overview

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