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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP2020BZER2R2M1A
- Part Number IHLP2020BZER2R2M1A
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP2020BZER2R2M1A Details
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Manufacturer Part Number:
IHLP2020BZER2R2M1A
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7.8
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Case/Size Code:
2020
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Construction:
Rectangular
IHLP2020BZER2R2M1A Frequently Asked Questions (FAQs)
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The recommended land pattern for IHLP2020BZER2R2M1A is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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Yes, IHLP2020BZER2R2M1A is rated for operation up to 155°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
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To prevent damage, handle IHLP2020BZER2R2M1A by the edges, avoiding touching the component body or leads. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Also, avoid bending or flexing the leads during assembly.
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The recommended soldering profile for IHLP2020BZER2R2M1A is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
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Yes, IHLP2020BZER2R2M1A is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent movement and damage.
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IHLP2020BZER2R2M1A Overview
Use the download button to access the IHLP2020BZER2R2M1A 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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