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IHLP2525CZER1R0M11 - Vishay

Description: Vishay, IHLP, 2225 (5664M) Shielded Wire-wound SMD Inductor with a Metal Composite Core, 1 μH ±20% Wire-Wound 12.5A Idc

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IHLP2525CZER1R0M11 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - 2525CZ
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IHLP2525CZER1R0M11 - Vishay  - 3D model - Inductors Precision Moulded - 2525CZ
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IHLP2525CZER1R0M11 Details

  • Manufacturer Part Number:

    IHLP2525CZER1R0M11

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.9

  • Case/Size Code:

    2525

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.008 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    HIGH CURRENT INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    3 mm

  • Package Length:

    6.47 mm

  • Package Style:

    SMT

  • Package Width:

    6.47 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    12.5 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    J BEND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP2525CZER1R0M11 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the IHLP2525CZER1R0M11 is a rectangular pad with a size of 2.5 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle the high self-resonant frequency of the IHLP2525CZER1R0M11, use a series resistor or a damping resistor to reduce the Q factor and prevent unwanted oscillations.
  • Yes, the IHLP2525CZER1R0M11 is rated for operation up to 125°C, but derating may be necessary for high-temperature applications. Consult the datasheet for specific derating guidelines.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the pads. Avoid overheating the component or using excessive solder.
  • The ESR of the IHLP2525CZER1R0M11 is not explicitly stated in the datasheet, but it can be estimated to be around 10-20 mΩ based on the component's design and materials.

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IHLP2525CZER1R0M11 Overview

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Part Image IHLP2525CZER1R0M1A Vishay Dale

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Part Image IHLP2525CZEK1R0M1A Vishay Intertechnologies

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