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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP2525CZER2R2M06
- Part Number IHLP2525CZER2R2M06
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP2525CZER2R2M06 Details
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Manufacturer Part Number:
IHLP2525CZER2R2M06
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7.8
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Case/Size Code:
2525
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Construction:
Rectangular
IHLP2525CZER2R2M06 Frequently Asked Questions (FAQs)
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The recommended land pattern for IHLP2525CZER2M06 is a rectangular pad with a size of 2.5 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1 mm.
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Handle the component by the edges or the terminals, avoiding touching the core or the windings. Use ESD-safe materials and tools to prevent electrostatic discharge damage. Avoid bending, flexing, or twisting the component during assembly.
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The maximum allowable voltage stress for IHLP2525CZER2R2M06 is 2.5 times the rated voltage (2.2V) for a maximum of 5 seconds. Prolonged exposure to high voltage stress can reduce the component's lifespan.
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IHLP2525CZER2R2M06 is rated for operation up to 125°C. However, the component's performance and lifespan may be affected at high temperatures. Derate the component's current rating by 1.5% per degree Celsius above 80°C to ensure reliable operation.
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Use a soldering iron with a temperature of 250°C to 270°C, and a solder with a melting point of 180°C to 220°C. Apply a small amount of solder to the terminal and ensure the component is properly aligned with the land pattern. Avoid overheating the component or using excessive solder.
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IHLP2525CZER2R2M06 Overview
Use the download button to access the IHLP2525CZER2R2M06 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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