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IHLP2525CZER4R7M11 - Vishay

Description: VISHAY - IHLP2525CZER4R7M11 - Power Inductor (SMD), 4.7 ?H, 6 A, Shielded, 4 A, IHLP-2525CZ-11 Series, 6.86mm x 6.47mm x 3mm

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PCB Footprints
IHLP2525CZER4R7M11 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - IHLP-2525
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IHLP2525CZER4R7M11 - Vishay  - 3D model - Inductors Precision Moulded - IHLP-2525
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IHLP2525CZER4R7M11 Details

  • Manufacturer Part Number:

    IHLP2525CZER4R7M11

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

IHLP2525CZER4R7M11 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the IHLP2525CZER4R7M11 is a rectangular pad with a size of 2.5 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle the IHLP2525CZER4R7M11's sensitivity to moisture, it is recommended to follow the standard moisture sensitivity level (MSL) handling procedures, including baking the components before reflow soldering and storing them in a dry environment.
  • The maximum operating temperature range for the IHLP2525CZER4R7M11 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
  • The self-resonant frequency (SRF) of the IHLP2525CZER4R7M11 can be calculated using the formula: SRF = 1 / (2 * π * √(L * C)), where L is the inductance value and C is the parasitic capacitance.
  • The recommended reflow soldering profile for the IHLP2525CZER4R7M11 is a peak temperature of 260°C, with a ramp-up rate of 3°C/s and a dwell time of 30-60 seconds above 220°C.

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IHLP2525CZER4R7M11 Overview

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