Part Image

IHLP2525EZER2R2M01 - Vishay

Description: VISHAY - IHLP2525EZER2R2M01 - INDUCTOR, 2.2UH, 10A, 20%, SMD

Download IHLP2525EZER2R2M01 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
IHLP2525EZER2R2M01 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - IHLP2525EZER2R2M01_A
click to zoom
3D Models
IHLP2525EZER2R2M01 - Vishay  - 3D model - Inductors Precision Moulded - IHLP2525EZER2R2M01_A
click to zoom

IHLP2525EZER2R2M01 Details

  • Manufacturer Part Number:

    IHLP2525EZER2R2M01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Case/Size Code:

    2525

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.0136 Ω

  • Inductance-Nom (L):

    2.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    5 mm

  • Package Length:

    6.47 mm

  • Package Style:

    SMT

  • Package Width:

    6.47 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    10 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    J BEND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP2525EZER2R2M01 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IHLP2525EZER2R2M01 is a rectangular pad with a length of 2.5 mm, a width of 2.5 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
  • The IHLP2525EZER2R2M01 has a maximum operating temperature of 125°C. To handle thermal derating, ensure that the inductor is operated within the recommended temperature range, and consider using a heat sink or thermal interface material to reduce the temperature rise. Additionally, follow the recommended PCB layout and thermal management guidelines to minimize thermal resistance.
  • The self-resonant frequency (SRF) of the IHLP2525EZER2R2M01 is not explicitly stated in the datasheet. However, based on the inductor's construction and materials, the SRF is typically in the range of 100 MHz to 500 MHz. To determine the exact SRF, perform a frequency sweep measurement using a network analyzer or a similar tool.
  • The IHLP2525EZER2R2M01 is a commercial-grade inductor, and its reliability and performance may not meet the stringent requirements of high-reliability or aerospace applications. For such applications, consider using a military-grade or space-grade inductor that meets the specific requirements of the application.
  • To ensure magnetic shielding, follow proper PCB layout guidelines, such as keeping the inductor away from other components and traces, using a solid ground plane, and minimizing the loop area of the circuit. Additionally, consider using a shielded inductor or a mu-metal shield to reduce electromagnetic interference (EMI).

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IHLP2525EZER2R2M01 Overview

Use the download button to access the IHLP2525EZER2R2M01 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IHLP2, or try a keyword search, such as Fixed Inductors

Parts related to IHLP2525EZER2R2M01

Showing 0 results