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IHLP5050FDER100M5A - Vishay

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IHLP5050FDER100M5A Details

  • Manufacturer Part Number:

    IHLP5050FDER100M5A

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Case/Size Code:

    5050

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.01776 Ω

  • Inductance-Nom (L):

    10 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    6.4 mm

  • Package Length:

    13.259 mm

  • Package Style:

    SMT

  • Package Width:

    12.9 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    12.1 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    10.7 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Pure Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP5050FDER100M5A Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IHLP5050FDER100M5A is a rectangular pad with a length of 5.5 mm, a width of 5.5 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
  • The IHLP5050FDER100M5A has a temperature derating curve specified in the datasheet. To handle thermal derating, ensure that the inductor's operating temperature is within the specified range (up to 125°C). Use a thermal interface material (TIM) to improve heat transfer between the inductor and the PCB. Also, consider using a heat sink or a thermal pad to dissipate heat.
  • The recommended soldering profile for the IHLP5050FDER100M5A is a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • To ensure magnetic shielding, keep the IHLP5050FDER100M5A at least 2 mm away from other magnetic components or conductive paths on the PCB. Use a magnetic shield or a mu-metal shield to contain the magnetic field. Additionally, orient the inductor to minimize magnetic field coupling with other components.
  • The self-resonant frequency (SRF) of the IHLP5050FDER100M5A is not explicitly specified in the datasheet. However, it can be estimated using the inductor's inductance value and the parasitic capacitance. Typically, the SRF of the IHLP5050FDER100M5A is in the range of 100-200 MHz.

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IHLP5050FDER100M5A Overview

Use the download button to access the IHLP5050FDER100M5A 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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