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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP5050FDER1R0MA1
- Part Number IHLP5050FDER1R0MA1
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP5050FDER1R0MA1 Details
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Manufacturer Part Number:
IHLP5050FDER1R0MA1
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7.8
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Case/Size Code:
5251
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Construction:
Rectangular
IHLP5050FDER1R0MA1 Frequently Asked Questions (FAQs)
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The recommended land pattern for IHLP5050FDER1R0MA1 is a rectangular pad with a size of 5.5 mm x 5.5 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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While IHLP5050FDER1R0MA1 has a rated operating temperature range of -40°C to +125°C, it's not recommended for high-temperature applications above 105°C due to potential degradation of the magnetic properties and increased core losses.
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To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the thermal stress on the component, and avoid applying excessive force or pressure during soldering.
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Yes, IHLP5050FDER1R0MA1 is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile and temperature to ensure reliable solder joints.
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Store IHLP5050FDER1R0MA1 in a dry, cool place, away from direct sunlight and moisture. Handle the components by the edges or body, avoiding touching the pins or magnetic core to prevent damage or contamination.
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IHLP5050FDER1R0MA1 Overview
Use the download button to access the IHLP5050FDER1R0MA1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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