Part Image

IHW25N120E1XKSA1 - Infineon

Description: INFINEON - IHW25N120E1XKSA1 - IGBT, SINGLE, 1.2KV, 50A, TO-247

Download IHW25N120E1XKSA1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
IHW25N120E1XKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO247-3_1
click to zoom
3D Models
IHW25N120E1XKSA1 - Infineon  - 3D model - Transistor Outline, Vertical - PG-TO247-3_1
click to zoom

IHW25N120E1XKSA1 Details

  • Manufacturer Part Number:

    IHW25N120E1XKSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Collector Current-Max (IC):

    50 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    1677 ns

IHW25N120E1XKSA1 Frequently Asked Questions (FAQs)

  • The maximum junction temperature for the IHW25N120E1XKSA1 is 175°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • To ensure proper cooling, it's essential to provide a sufficient heat sink and thermal interface material (TIM) between the device and the heat sink. The heat sink should be designed to dissipate the maximum power loss of the device, and the TIM should have a thermal conductivity of at least 5 W/mK.
  • The recommended gate drive voltage for the IHW25N120E1XKSA1 is between 10 V and 15 V. However, the optimal gate drive voltage may vary depending on the specific application and switching frequency. It's recommended to consult the datasheet and application notes for more information.
  • To protect the IHW25N120E1XKSA1 from overvoltage and overcurrent, it's recommended to use a voltage clamp or a surge protector to limit the voltage across the device. Additionally, a current sense resistor and a fuse can be used to detect and respond to overcurrent conditions.
  • The recommended PCB layout and design considerations for the IHW25N120E1XKSA1 include using a multi-layer PCB with a solid ground plane, minimizing the length of the power traces, and using a Kelvin connection for the gate driver. It's also recommended to follow the guidelines outlined in the datasheet and application notes.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IHW25N120E1XKSA1 Overview

Use the download button to access the IHW25N120E1XKSA1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IHW25, or try a keyword search, such as IGBTs

Parts related to IHW25N120E1XKSA1

Showing 0 results