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ILC0402ER1N0S - Vishay

Description: Inductor High Frequency Chip Multi-Layer 1nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 120mOhm DCR 0402 T/R

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ILC0402ER1N0S - Vishay - PCB symbol
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ILC0402ER1N0S - Vishay PCB footprint - Inductors Chip - Inductors Chip - ILC0402
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ILC0402ER1N0S - Vishay - 3D model - Inductors Chip - ILC0402
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ILC0402ER1N0S Details

  • Manufacturer Part Number:

    ILC0402ER1N0S

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP, 0402, HALOGEN FREE AND ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.12 Ω

  • Inductance-Nom (L):

    0.001 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.3 A

  • Self Resonance Frequency:

    10000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    INDUCTANCE TOLERANCE IS 0.3 NANO HENRY

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    30%

ILC0402ER1N0S Frequently Asked Questions (FAQs)

  • The recommended land pattern for ILC0402ER1N0S is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • ILC0402ER1N0S is rated for operation up to 150°C, but it's recommended to derate the component's power rating at higher temperatures. Consult the datasheet for specific derating guidelines. Additionally, ensure that the component is properly soldered and mounted to prevent thermal stress.
  • ILC0402ER1N0S is a static-sensitive device. Handle the component with proper ESD protection, such as wearing an anti-static wrist strap or using an ESD-safe workstation. Avoid touching the component's pins or body, and ensure that the component is stored in an anti-static bag or container.
  • The recommended soldering profile for ILC0402ER1N0S is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
  • ILC0402ER1N0S is not hermetically sealed, so it's not recommended for use in humid or moist environments. If the component is exposed to moisture, it may lead to corrosion or electrical failure. Consider using a conformal coating or potting compound to protect the component in harsh environments.

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ILC0402ER1N0S Overview

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