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ILD74 - Vishay

Description: Optocoupler DC-IN 2-CH Trans DC-OUT

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Symbol
ILD74 - Vishay - PCB symbol
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PCB Footprints
ILD74 - Vishay PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP-8
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3D Models
ILD74 - Vishay - 3D model - Dual-In-Line Packages - DIP-8
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ILD74 Details

  • Manufacturer Part Number:

    ILD74

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    20 V

  • Configuration:

    SEPARATE, 2 CHANNELS

  • Current Transfer Ratio-Min:

    12.5%

  • Current Transfer Ratio-Nom:

    35%

  • Dark Current-Max:

    500 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.5 V

  • Isolation Voltage-Max:

    5300 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    2

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.3 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

ILD74 Frequently Asked Questions (FAQs)

  • The recommended storage condition for ILD74 is in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -40°C to 125°C.
  • ILD74 is an ESD-sensitive device. To prevent damage, handle the device with an anti-static wrist strap or mat, and ensure that the workstation is ESD-protected.
  • The maximum power dissipation for ILD74 is 1.5 W. Exceeding this limit may cause the device to overheat and fail.
  • Yes, ILD74 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high performance and long-term stability.
  • ILD74 can be soldered using a wave soldering process or a reflow soldering process. The recommended soldering temperature is between 200°C to 240°C, and the soldering time should not exceed 10 seconds.

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ILD74 Overview

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