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ILD8150EXUMA1 - Infineon

Description: LED Lighting Drivers LED DRIVER

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Symbol
ILD8150EXUMA1 - Infineon - PCB symbol
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PCB Footprints
ILD8150EXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8 with exposed pad
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3D Models
ILD8150EXUMA1 - Infineon - 3D model - Small Outline Packages - PG-DSO-8 with exposed pad
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ILD8150EXUMA1 Details

  • Manufacturer Part Number:

    ILD8150EXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Germany, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.95 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    3

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Seated Height-Max:

    1.7 mm

  • Supply Current-Max:

    2.3 mA

  • Supply Voltage-Max:

    80 V

  • Supply Voltage-Min:

    8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

  • fmax-Min:

    0.02 MHz

ILD8150EXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • Infineon recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK between the device and the heat sink. Additionally, ensure that the heat sink is properly attached to the device using a suitable mounting method.
  • The maximum allowed voltage on the VIN pin is 36 V, but it's recommended to operate within the specified range of 12 V to 24 V for optimal performance and reliability.
  • The device requires a specific power sequencing to ensure proper operation. The VIN pin should be powered up before the VCC pin, and the VCC pin should be powered down before the VIN pin. A minimum delay of 10 ms is recommended between power-up and power-down sequences.
  • Infineon recommends using a human-body model (HBM) ESD protection of at least 2 kV and a charged-device model (CDM) ESD protection of at least 500 V to ensure reliable operation.

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ILD8150EXUMA1 Overview

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