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ILX3485DT - IKSEMICON

Description: RS-485/RS-422 ICs 1/1 5Mbps 3V ~ 3.6V SOP-8 RoHS

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ILX3485DT - IKSEMICON PCB footprint - Small Outline Packages - Small Outline Packages - D SUFFIX SOIC (MS - 012AA)
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ILX3485DT - IKSEMICON  - 3D model - Small Outline Packages - D SUFFIX SOIC (MS - 012AA)
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ILX3485DT Details

  • Manufacturer Part Number:

    ILX3485DT

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    IKSemicon Co Ltd

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Receive Delay-Max:

    200 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    100 ns

  • Width:

    3.9 mm

ILX3485DT Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the IC is recommended. Keep the switching node (SW pin) away from sensitive analog nodes.
  • Use a low-ESR input capacitor, ensure the input voltage ramp-up time is >10ms, and add a soft-start circuit to prevent inrush currents.
  • The maximum output capacitance should be limited to 22uF to ensure stability. Exceeding this value may cause oscillations or instability.
  • Choose an inductor with a low DCR (<10mΩ), high saturation current (>2x the peak current), and a core material with low core loss (e.g., ferrite or powdered iron).
  • Use a heat sink with a thermal resistance <10°C/W, apply thermal interface material, and ensure good airflow around the IC. Keep the ambient temperature below 85°C.

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