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IM828XCCXKMA1 - Infineon

Description: Power Driver Module IGBT 3 Phase Inverter 1.2 kV 35 A 24-PowerDIP Module (1.094", 27.80mm)

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IM828XCCXKMA1 - Infineon - PCB symbol
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PCB Footprints
IM828XCCXKMA1 - Infineon PCB footprint - Other - Other - 24-PowerDIP Module_2024
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IM828XCCXKMA1 - Infineon - 3D model - Other - 24-PowerDIP Module_2024
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IM828XCCXKMA1 Details

  • Manufacturer Part Number:

    IM828XCCXKMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-36/24 PIN

  • Country Of Origin:

    Malaysia, South Korea

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    27 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDIP-T24

  • Length:

    36 mm

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    35 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP24/36,1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Seated Height-Max:

    5.6 mm

  • Supply Voltage-Max (Vsup):

    18.5 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.6 mm

  • Terminal Position:

    DUAL

  • Width:

    22.86 mm

IM828XCCXKMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to ensure good thermal conductivity. A minimum of 1 oz copper thickness is recommended.
  • Infineon recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK between the device and the heat sink. Additionally, ensure good airflow and avoid blocking the airflow around the device.
  • The maximum allowed voltage on the VCC pin is 5.5V. Exceeding this voltage may damage the device.
  • Infineon recommends using ESD-protective packaging, handling the device by the body, and using an ESD wrist strap or mat during assembly. Avoid touching the device pins or exposing them to static electricity.
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a cooling rate of 4°C/s. Avoid exceeding 280°C to prevent damage to the device.

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IM828XCCXKMA1 Overview

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