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IMC101TT038XUMA1 - Infineon

Description: INFINEON - IMC101TT038XUMA1 - Motor Driver/Controller, PMSM, 3V to 5.5V, 1 Output, TSSOP-38

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IMC101TT038XUMA1 - Infineon - PCB symbol
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PCB Footprints
IMC101TT038XUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSSOP-38-
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3D Models
IMC101TT038XUMA1 - Infineon - 3D model - Small Outline Packages - PG-TSSOP-38-
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IMC101TT038XUMA1 Details

  • Manufacturer Part Number:

    IMC101TT038XUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TSSOP-38

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G38

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP38,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    20 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

IMC101TT038XUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The IMC101TT038XUMA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. A minimum of 1kΩ resistance and 100pF capacitance is recommended for ESD protection on the input lines.
  • Yes, the IMC101TT038XUMA1 is qualified for operation in humid environments, but it's recommended to follow proper moisture sensitivity level (MSL) handling and storage procedures to prevent damage.
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a cooling rate of 4°C/s. Consult the datasheet for more detailed information.

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IMC101TT038XUMA1 Overview

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