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IMM0212D03 - XP POWER

Description: XP Power Through Hole 2W Isolated DC-DC Converter, Vin 9 → 18 V dc Medical Approved, I/O isolation 1.5kV ac

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PCB Footprints
IMM0212D03 - XP POWER PCB footprint - Other - Other - IMM0212D03-2
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3D Models
IMM0212D03 - XP POWER  - 3D model - Other - IMM0212D03-2
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IMM0212D03 Details

  • Manufacturer Part Number:

    IMM0212D03

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SIP-8/6

  • ECCN Code:

    EAR99

  • Manufacturer:

    XP Power

  • YTEOL:

    5

  • Additional Feature:

    -3.3V OUTPUT ALSO AVAILABLE

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    CB, CE, CSA, EN, IEC, TUV, UKCA, UL

  • Efficiency (Main Output):

    79%

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XSIP-T6

  • Length:

    21.85 mm

  • Line Regulation-Max:

    0.5%

  • Load Regulation-Max:

    2%

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    0.303 A

  • Output Voltage-Max:

    3.366 V

  • Output Voltage-Min:

    3.234 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SIP

  • Package Equivalence Code:

    SIP6/8,.13

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Protections:

    OVER LOAD; SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.033 Vrms

  • Screening Level:

    EN 60601-1; IEC 61010-1; One MOPP

  • Seated Height-Max:

    11.1 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Total Power Output-Max:

    2 W

  • Trim/Adjustable Output:

    NO

  • Width:

    9.2 mm

IMM0212D03 Frequently Asked Questions (FAQs)

  • XP Power recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
  • Yes, the IMM0212D03 is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in high-vibration environments. However, it's essential to ensure proper mounting and screw torque to prevent damage or dislodging of the module.
  • To ensure EMC, XP Power recommends using a metal enclosure, keeping the module away from sensitive components, and using proper cable shielding and filtering. Additionally, the module's input and output cables should be kept as short as possible and routed away from each other.
  • The IMM0212D03 can tolerate input voltage deviations of up to ±10% of the nominal input voltage without affecting its performance or reliability. However, it's essential to ensure that the input voltage remains within the specified range to maintain the module's efficiency and lifespan.
  • The IMM0212D03 has a conformal coating that provides some protection against humidity and moisture. However, it's not designed for use in wet or submerged environments. If you need to use the module in a humid environment, ensure that it's properly sealed and protected from moisture ingress.

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IMM0212D03 Overview

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