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IMZA120R040M1HXKSA1 - Infineon

Description: N Channel Through Hole 1200V 55A(Tc) 227W(Tc) PG-TO247-4-8

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IMZA120R040M1HXKSA1 - Infineon PCB footprint - Other - Other - PG-TO247-4-U02
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IMZA120R040M1HXKSA1 - Infineon  - 3D model - Other - PG-TO247-4-U02
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IMZA120R040M1HXKSA1 Details

  • Manufacturer Part Number:

    IMZA120R040M1HXKSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    339 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND KELVIN SENSOR

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    55 A

  • Drain-source On Resistance-Max:

    0.0615 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    11 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    227 W

  • Pulsed Drain Current-Max (IDM):

    117 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

IMZA120R040M1HXKSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom side of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper thermal management, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermistor or thermocouple to monitor the temperature.
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 60-90 seconds, and a cooling rate of 4°C/s or slower.
  • Yes, but ensure proper mounting and mechanical fixation of the component to prevent damage. Also, consider using a vibration-resistant soldering process.
  • Follow standard ESD precautions, such as using an ESD wrist strap, mat, or workstation, and ensure that the component is stored in an ESD-protective package.

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IMZA120R040M1HXKSA1 Overview

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