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INN3647C-H606-TL - Power Integrations

Description: Converter Offline Flyback, Secondary Side SR Topology 45kHz InSOP-24D

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PCB Footprints
INN3647C-H606-TL - Power Integrations PCB footprint - Other - Other - InSOP-24D_2023-1
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3D Models
INN3647C-H606-TL - Power Integrations  - 3D model - Other - InSOP-24D_2023-1
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INN3647C-H606-TL Details

  • Manufacturer Part Number:

    INN3647C-H606-TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    7

  • Analog IC - Other Type:

    LOAD SWITCH

INN3647C-H606-TL Frequently Asked Questions (FAQs)

  • Power Integrations provides a recommended PCB layout guide in their application notes (e.g., AN-63) and evaluation board designs. It's essential to follow these guidelines to ensure optimal thermal performance and minimize thermal resistance.
  • The input capacitor selection depends on the input voltage, current, and ripple requirements. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the maximum input voltage, and a capacitance value that ensures the ripple voltage is within the specified limits. Power Integrations also provides guidance on capacitor selection in their application notes.
  • The maximum allowed junction temperature for the INN3647C-H606-TL is 150°C. It's essential to ensure that the device operates within this temperature range to prevent thermal shutdown and ensure reliability.
  • Power Integrations provides a troubleshooting guide in their application notes (e.g., AN-61) that covers common issues and their solutions. Additionally, engineers can use tools like oscilloscopes and thermal cameras to diagnose issues and identify the root cause.
  • The INN3647C-H606-TL is rated for operation up to 5000 meters altitude and -40°C to 125°C temperature range. However, engineers should consult Power Integrations' application notes and perform thorough testing to ensure the device meets the specific requirements of their design.

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