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INN3649C-H606-TL - Power Integrations

Description: AC/DC Converters 1700 V 65 W (85-670 V AC)

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PCB Footprints
INN3649C-H606-TL - Power Integrations PCB footprint - Other - Other - InSOP-24D_2023-2
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3D Models
INN3649C-H606-TL - Power Integrations  - 3D model - Other - InSOP-24D_2023-2
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INN3649C-H606-TL Details

  • Manufacturer Part Number:

    INN3649C-H606-TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    7

  • Analog IC - Other Type:

    LOAD SWITCH

INN3649C-H606-TL Frequently Asked Questions (FAQs)

  • Power Integrations provides a recommended PCB layout guide in their application notes (e.g., AN-63) and evaluation board designs. It's essential to follow these guidelines to ensure optimal thermal performance and minimize thermal resistance.
  • The input capacitor selection depends on the input voltage, current, and ripple requirements. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the maximum input voltage, and a capacitance value that ensures the ripple voltage is within the specified limits. Power Integrations also provides guidance on capacitor selection in their application notes.
  • The BYPASS pin is typically connected to a capacitor to filter the internal voltage reference. The maximum allowed voltage on this pin is usually limited to the internal voltage reference voltage (typically around 5V) plus the capacitor's voltage rating. Exceeding this voltage may damage the IC.
  • To ensure proper biasing during startup, make sure the input voltage is within the specified range, and the input capacitor is properly sized to provide a stable input voltage. Additionally, the BYPASS pin capacitor should be sized to filter the internal voltage reference and prevent voltage spikes during startup.
  • The recommended heatsink design depends on the specific application and thermal requirements. Power Integrations provides thermal design guidelines and examples in their application notes and evaluation board designs. A general guideline is to use a heatsink with a thermal resistance of less than 10°C/W to ensure the IC operates within its specified temperature range.

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