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INN3673C-H602-TL - Power Integrations

Description: AC/DC Converters Off-line CV/CC 725V 15W Adapter 12W

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INN3673C-H602-TL - Power Integrations PCB footprint - Other - Other - InSOP-24D
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INN3673C-H602-TL - Power Integrations  - 3D model - Other - InSOP-24D
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INN3673C-H602-TL Details

  • Manufacturer Part Number:

    INN3673C-H602-TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    6

  • Analog IC - Other Type:

    LOAD SWITCH

  • Control Technique:

    RESONANT CONTROL

  • Moisture Sensitivity Level:

    3

  • Output Current-Max:

    1.445 A

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    145 kHz

  • Temperature Grade:

    INDUSTRIAL

INN3673C-H602-TL Frequently Asked Questions (FAQs)

  • Power Integrations provides a recommended PCB layout in their application notes (e.g., AN-63) and evaluation board designs. Key considerations include keeping the high-current paths short, using thermal vias, and providing adequate copper area for heat dissipation.
  • To ensure reliable start-up and operation, follow the recommended input voltage sequencing and ramp-up rates, and consider adding input voltage monitoring and UVLO (Under-Voltage Lockout) protection. Additionally, ensure that the input capacitor is properly sized and selected for the application.
  • For EMI filter design and layout, consider the following: use a common-mode choke with a high impedance at the switching frequency, place the EMI filter components close to the INN3673C-H602-TL, and use a shielded enclosure or metal can to reduce radiated emissions. Follow the guidelines in Power Integrations' application notes and the EN55022 standard.
  • To optimize for high efficiency and low standby power consumption, follow these guidelines: select the optimal switching frequency, use a high-efficiency transformer design, minimize the output voltage ripple, and optimize the component selection (e.g., low-RDS(on) MOSFETs, low-ESR capacitors). Additionally, consider using Power Integrations' proprietary EcoSmart technology.
  • For high-power applications, ensure proper thermal management by using a heat sink with a low thermal resistance, applying a thermal interface material (TIM), and providing adequate airflow. Monitor the junction temperature (TJ) and adjust the design accordingly to prevent overheating and ensure reliable operation.

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