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IPA057N06N3GXKSA1 - Infineon

Description: MOSFET N-Ch 60V 60A TO220FP-3 OptiMOS 3

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PCB Footprints
IPA057N06N3GXKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO220-3-31
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3D Models
IPA057N06N3GXKSA1 - Infineon  - 3D model - Transistor Outline, Vertical - PG-TO220-3-31
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IPA057N06N3GXKSA1 Details

  • Manufacturer Part Number:

    IPA057N06N3GXKSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    GREEN, PLASTIC, TO-220, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    77 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.0057 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    240 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPA057N06N3GXKSA1 Frequently Asked Questions (FAQs)

  • The IPA057N06N03GXKSA1 has an operating temperature range of -40°C to 150°C, as specified in the datasheet. However, it's recommended to derate the device's performance at higher temperatures to ensure reliability and longevity.
  • To ensure reliability in high-humidity environments, it's essential to follow proper handling and storage procedures, such as storing the devices in a dry, nitrogen-filled environment. Additionally, consider using moisture-sensitive device (MSD) handling and baking procedures to prevent moisture absorption.
  • For optimal thermal management, it's recommended to use a PCB layout with a large copper area for heat dissipation. A minimum of 2 oz copper thickness is recommended. Additionally, consider using thermal vias and a heat sink to further improve heat dissipation. Refer to Infineon's application notes for more detailed guidance.
  • Yes, the IPA057N06N03GXKSA1 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard and is designed to withstand the harsh conditions of automotive environments. However, it's essential to follow Infineon's guidelines for automotive applications and to consult with their technical support team for specific requirements.
  • For troubleshooting and debugging, refer to Infineon's application notes and technical documentation. Use oscilloscopes and logic analyzers to monitor the device's signals and identify potential issues. Additionally, consider using Infineon's development boards and evaluation kits to simplify the debugging process.

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IPA057N06N3GXKSA1 Overview

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