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IPA70R450P7SXKSA1 - Infineon

Description: MOSFET CONSUMER

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IPA70R450P7SXKSA1 - Infineon - PCB symbol
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PCB Footprints
IPA70R450P7SXKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO 220 fullpack
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3D Models
IPA70R450P7SXKSA1 - Infineon - 3D model - Transistor Outline, Vertical - PG-TO 220 fullpack
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IPA70R450P7SXKSA1 Details

  • Manufacturer Part Number:

    IPA70R450P7SXKSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-220FP, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    700 V

  • Drain-source On Resistance-Max:

    0.45 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    25.9 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPA70R450P7SXKSA1 Frequently Asked Questions (FAQs)

  • The IPA70R450P7SXKSA1 can operate from -40°C to 150°C, with a junction temperature (Tj) of up to 175°C.
  • The device has a thermal pad on the bottom that should be connected to a heat sink or a thermal interface material (TIM) to ensure proper heat dissipation. A minimum thermal resistance of 1.5 K/W is recommended.
  • A 2-layer or 4-layer PCB is recommended, with a solid ground plane and a separate power plane. The device's thermal pad should be connected to the heat sink or TIM, and the PCB should be designed to minimize thermal resistance.
  • The IPA70R450P7SXKSA1 requires a specific power sequencing order: VCC should be powered up first, followed by VGS. The device should not be operated with VGS greater than VCC.
  • The IPA70R450P7SXKSA1 has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. A human body model (HBM) of 2 kV and a charged device model (CDM) of 1 kV are recommended.

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IPA70R450P7SXKSA1 Overview

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