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IPB180P04P403ATMA2 - Infineon

Description: -40V, P-Ch, 2.8 mΩ max, Automotive MOSFET, D2PAK 7pin, OptiMOS™-P2

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IPB180P04P403ATMA2 - Infineon PCB footprint - Other - Other - IPB180P04P403ATMA2-4
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IPB180P04P403ATMA2 - Infineon  - 3D model - Other - IPB180P04P403ATMA2-4
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IPB180P04P403ATMA2 Details

  • Manufacturer Part Number:

    IPB180P04P403ATMA2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    90 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    180 A

  • Drain-source On Resistance-Max:

    0.0028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    220 pF

  • JEDEC-95 Code:

    TO-263

  • JESD-30 Code:

    R-PSSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    150 W

  • Pulsed Drain Current-Max (IDM):

    720 A

  • Reference Standard:

    AEC-Q101; IEC-68-1

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPB180P04P403ATMA2 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IPB180P04P403ATMA2 is -40°C to 150°C.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of ≤ 10 K/W, and ensuring good airflow around the device.
  • A recommended PCB layout for IPB180P04P403ATMA2 includes a solid ground plane, wide power traces, and a decoupling capacitor (e.g., 100nF) close to the device.
  • The device should be powered up and down slowly (e.g., 10ms) to prevent voltage spikes and ensure proper operation.
  • The recommended soldering conditions for IPB180P04P403ATMA2 are: peak temperature ≤ 260°C, time above 217°C ≤ 30s, and a soldering iron temperature ≤ 350°C.

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IPB180P04P403ATMA2 Overview

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