Part Image

IPC50N04S55R8ATMA1 - Infineon

Description: MOSFET N-CHANNEL 30/40V

Download IPC50N04S55R8ATMA1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
IPC50N04S55R8ATMA1 - Infineon PCB footprint - Other - Other - PG-TDSON-8-34
click to zoom
3D Models
IPC50N04S55R8ATMA1 - Infineon  - 3D model - Other - PG-TDSON-8-34
click to zoom

IPC50N04S55R8ATMA1 Details

  • Manufacturer Part Number:

    IPC50N04S55R8ATMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Germany, Indonesia, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    30 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.0072 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

IPC50N04S55R8ATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IPC50N04S55R8ATMA1 is -55°C to 175°C.
  • To minimize switching losses, ensure the gate drive voltage is sufficient (typically 10-15V), and the gate resistance is minimized (e.g., using a low-impedance gate driver).
  • To minimize parasitic inductance, use a compact PCB layout with short, wide traces for the drain, source, and gate connections. Keep the gate and source connections close together, and use a solid ground plane.
  • Yes, the IPC50N04S55R8ATMA1 is suitable for high-frequency switching applications up to several hundred kHz, but ensure proper gate drive and PCB layout to minimize switching losses.
  • Use a suitable overvoltage protection circuit (e.g., TVS diode) and overcurrent protection (e.g., current sense resistor and comparator) to prevent damage to the MOSFET.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IPC50N04S55R8ATMA1 Overview

Use the download button to access the IPC50N04S55R8ATMA1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IPC50, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IPC50N04S55R8ATMA1

Showing 0 results