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IPD060N03LGATMA1 - Infineon

Description: MOSFET N-Ch 30V 50A DPAK-2 OptiMOSª3Power-Transistor,30V

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IPD060N03LGATMA1 - Infineon PCB footprint - Other - Other - IPD060N03LGATMA1
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IPD060N03LGATMA1 Details

  • Manufacturer Part Number:

    IPD060N03LGATMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252

  • Package Description:

    GREEN, PLASTIC PACKAGE-3

  • Pin Count:

    4

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    60 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.009 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    350 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPD060N03LGATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IPD060N03LGATMA1 is -55°C to 175°C.
  • To minimize switching losses, ensure the gate-source voltage (Vgs) is within the recommended range (typically 10-15V), and use a gate driver with a low output impedance to reduce ringing and oscillations.
  • To minimize parasitic inductance, use a compact PCB layout with short, wide traces, and place the MOSFET close to the gate driver. Use a ground plane to reduce electromagnetic interference (EMI).
  • Use a voltage clamp or a zener diode to protect the MOSFET from overvoltage conditions. Implement overcurrent protection using a current sense resistor and a comparator or a dedicated overcurrent protection IC.
  • The recommended gate resistor value depends on the specific application and gate driver used. A typical value is in the range of 10-100 ohms, but consult the gate driver datasheet for specific recommendations.

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