Part Image

IPD50P04P4L11ATMA1 - Infineon

Description: INFINEON - IPD50P04P4L11ATMA1 - MOSFET, P CH, -40V, -50A, TO-252-3

Download IPD50P04P4L11ATMA1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
IPD50P04P4L11ATMA1 - Infineon PCB footprint - Other - Other - Infineon-PG-TO252-3_ffw
click to zoom

IPD50P04P4L11ATMA1 Details

  • Manufacturer Part Number:

    IPD50P04P4L11ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GREEN, PLASTIC PACKAGE-3/2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    18 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.0106 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPD50P04P4L11ATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IPD50P04P4L11ATMA1 is -40°C to 150°C.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of ≤ 10 K/W, and ensuring good airflow around the device.
  • A recommended PCB layout for IPD50P04P4L11ATMA1 includes a solid ground plane, wide power traces, and a decoupling capacitor (e.g., 100nF) close to the device.
  • The device should be powered up and down slowly (e.g., 10ms) to prevent voltage spikes and ensure proper operation.
  • The recommended soldering conditions for IPD50P04P4L11ATMA1 are: peak temperature ≤ 260°C, time above 217°C ≤ 30s, and a soldering iron temperature ≤ 350°C.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IPD50P04P4L11ATMA1 Overview

Use the download button to access the IPD50P04P4L11ATMA1 schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like IPD50, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IPD50P04P4L11ATMA1

Showing 0 results

IPD50P04P4L11ATMA1 Alternates

Showing results

Image Part Number Model
Part Image IPD50P04P4L11ATMA2 Infineon Technologies AG

Power Field-Effect Transistor, 50A I(D), 40V, 0.0106ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252

Part Image IPD50P04P4L-11 Infineon Technologies AG

Power Field-Effect Transistor, 50A I(D), 40V, 0.0106ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252

Part Image SUD50P04-09L-E3 Vishay Siliconix

Power Field-Effect Transistor, 50A I(D), 40V, 0.0094ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252