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IPD60R1K4C6ATMA1 - Infineon

Description: MOSFET LOW POWER_LEGACY

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IPD60R1K4C6ATMA1 - Infineon PCB footprint - Other - Other - IPD60R1K4C6ATMA1-2
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IPD60R1K4C6ATMA1 - Infineon  - 3D model - Other - IPD60R1K4C6ATMA1-2
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IPD60R1K4C6ATMA1 Details

  • Manufacturer Part Number:

    IPD60R1K4C6ATMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Germany, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    26 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain-source On Resistance-Max:

    1.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    8 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPD60R1K4C6ATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IPD60R1K4C6ATMA1 is -40°C to 150°C.
  • To ensure reliability, it is recommended to follow the recommended operating conditions, use a suitable thermal management system, and consider derating the device's power handling capabilities at high temperatures.
  • The recommended PCB layout and thermal design for the IPD60R1K4C6ATMA1 can be found in the Infineon application note AN2019-01, which provides guidelines for optimal thermal performance and PCB design.
  • The thermal pad of the IPD60R1K4C6ATMA1 should be connected to a thermal ground plane or a heat sink to ensure efficient heat dissipation. During assembly and rework, it is essential to avoid damaging the thermal pad and to follow the recommended soldering and desoldering procedures.
  • The IPD60R1K4C6ATMA1 has an integrated ESD protection circuit, but it is still recommended to follow standard ESD protection procedures during handling and assembly to prevent damage to the device.

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IPD60R1K4C6ATMA1 Overview

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