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IPD900P06NMATMA1 - Infineon

Description: INFINEON - IPD900P06NMATMA1 - Power MOSFET, P Channel, 60 V, 16.4 A, 0.075 ohm, TO-252 (DPAK), Surface Mount

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IPD900P06NMATMA1 - Infineon PCB footprint - Other - Other - PG-TO 252-3 (D-PAK)
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IPD900P06NMATMA1 Details

  • Manufacturer Part Number:

    IPD900P06NMATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    209 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    16.4 A

  • Drain-source On Resistance-Max:

    0.09 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    39 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    63 W

  • Pulsed Drain Current-Max (IDM):

    65.6 A

  • Reference Standard:

    IEC-68-1; IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPD900P06NMATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IPD900P06NMATMA1 is -40°C to 150°C.
  • To ensure reliability, it is recommended to follow the recommended operating conditions, use a suitable thermal management system, and consider derating the device's power handling capabilities at high temperatures.
  • The recommended PCB layout and thermal design for the IPD900P06NMATMA1 involves using a multi-layer PCB with a large copper area for heat dissipation, and ensuring good thermal conductivity between the device and the heat sink or thermal interface material.
  • To handle the high current handling capabilities of the IPD900P06NMATMA1, it is recommended to use wide PCB traces, multiple vias, and a solid copper pour to ensure low impedance and good thermal conductivity.
  • The IPD900P06NMATMA1 has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures during assembly and testing, and to use ESD protection devices such as TVS diodes or ESD suppressors in the system design.

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IPD900P06NMATMA1 Overview

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