Part Image

IPN50R650CEATMA1 - Infineon

Description: MOSFET CONSUMER

Download IPN50R650CEATMA1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
IPN50R650CEATMA1 - Infineon PCB footprint - Other - Other - IPN50R650CEATMA1-1
click to zoom

IPN50R650CEATMA1 Details

  • Manufacturer Part Number:

    IPN50R650CEATMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-223, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    102 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    9 A

  • Drain-source On Resistance-Max:

    0.65 Ω

  • FET Technology:

    SUPERJUNCTION MOSFET

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    5 W

  • Pulsed Drain Current-Max (IDM):

    19 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPN50R650CEATMA1 Frequently Asked Questions (FAQs)

  • The maximum junction temperature for IPN50R650CEATMA1 is 150°C, as specified in the datasheet. However, it's recommended to keep the junction temperature below 125°C for reliable operation.
  • Proper cooling is crucial for the IGBT's reliability. Ensure good thermal contact between the IGBT and the heat sink, and use a thermal interface material if necessary. Also, ensure good airflow around the heat sink to dissipate heat efficiently.
  • The recommended gate resistor value for IPN50R650CEATMA1 is between 10 ohms and 20 ohms. However, the optimal value may vary depending on the specific application and switching frequency.
  • Yes, IPN50R650CEATMA1 can be used in a parallel configuration, but it's essential to ensure that the IGBTs are matched in terms of their electrical characteristics and thermal performance. Also, a common gate drive and proper thermal management are crucial for reliable operation.
  • The maximum allowable voltage transient for IPN50R650CEATMA1 is specified as 650V + 100V (transient voltage). However, it's recommended to limit the voltage transient to 100V to ensure reliable operation and prevent damage to the IGBT.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IPN50R650CEATMA1 Overview

Use the download button to access the IPN50R650CEATMA1 schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like IPN50, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IPN50R650CEATMA1

Showing 0 results