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IPP120P04P4L03AKSA1 - Infineon

Description: MOSFET P-Ch 40V 120A OptiMOS-P2 TO-220

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IPP120P04P4L03AKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IPP120P04P4L03AKSA1
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IPP120P04P4L03AKSA1 - Infineon  - 3D model - Transistor Outline, Vertical - IPP120P04P4L03AKSA1
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IPP120P04P4L03AKSA1 Details

  • Manufacturer Part Number:

    IPP120P04P4L03AKSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GREEN, PLASTIC, TO-220, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    78 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.0052 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    480 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPP120P04P4L03AKSA1 Frequently Asked Questions (FAQs)

  • The IPP120P04P4L03AKSA1 has an operating temperature range of -40°C to 150°C, making it suitable for high-reliability applications.
  • The device has a thermal pad on the bottom side, which should be connected to a heat sink or a thermal interface material to ensure proper heat dissipation. A thermal resistance of <1 K/W is recommended.
  • A 2-layer or 4-layer PCB is recommended, with a solid ground plane and a separate power plane. The device's thermal pad should be connected to the heat sink or thermal interface material.
  • The device requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is VCC, then VGS, and power-down sequence is VGS, then VCC.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device, such as using an ESD wrist strap or mat.

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IPP120P04P4L03AKSA1 Overview

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