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IPT029N08N5ATMA1 - Infineon

Description: N-Channel 80 V 52A (Ta), 169A (Tc) 168W (Tc) Surface Mount PG-HSOF-8-1

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IPT029N08N5ATMA1 - Infineon PCB footprint - Other - Other - IPT029N08N5ATMA1-3
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IPT029N08N5ATMA1 Details

  • Manufacturer Part Number:

    IPT029N08N5ATMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HSOF-8

  • Country Of Origin:

    Austria, Germany, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    124 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    52 A

  • Drain-source On Resistance-Max:

    0.0029 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    676 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPT029N08N5ATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IPT029N08N05ATMA1 is -40°C to 150°C.
  • To ensure optimal performance, the device should be biased with a gate-source voltage (Vgs) between 4V to 10V, and a drain-source voltage (Vds) not exceeding 30V.
  • For optimal thermal performance, it is recommended to use a PCB with a thermal pad and a heat sink. The device should be placed on a copper plane with a minimum size of 1 inch x 1 inch, and a thermal via should be placed under the device to dissipate heat.
  • To protect the device from ESD, it is recommended to handle the device with an anti-static wrist strap or mat, and to use ESD-protected packaging and storage.
  • The recommended gate resistor value for IPT029N08N05ATMA1 is between 10Ω to 100Ω, depending on the specific application and switching frequency.

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IPT029N08N5ATMA1 Overview

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