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IPW65R115CFD7AXKSA1 - Infineon

Description: MOSFET AUTOMOTIVE

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PCB Footprints
IPW65R115CFD7AXKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - pg-to247-3
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3D Models
IPW65R115CFD7AXKSA1 - Infineon  - 3D model - Transistor Outline, Vertical - pg-to247-3
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IPW65R115CFD7AXKSA1 Details

  • Manufacturer Part Number:

    IPW65R115CFD7AXKSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    97 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    21 A

  • Drain-source On Resistance-Max:

    0.115 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    114 W

  • Pulsed Drain Current-Max (IDM):

    82 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPW65R115CFD7AXKSA1 Frequently Asked Questions (FAQs)

  • The thermal resistance of the package is typically around 1.5°C/W for junction-to-case and 3.5°C/W for junction-to-ambient, but it's recommended to consult the application note or contact Infineon support for more accurate information.
  • Proper cooling can be achieved by using a heat sink with a thermal interface material, ensuring good airflow, and keeping the device away from other heat sources. The application note provides more detailed guidance on thermal design and layout considerations.
  • The recommended PCB layout is provided in the application note, which includes guidelines for pad layout, thermal vias, and decoupling capacitors. It's essential to follow these guidelines to ensure optimal performance and reliability.
  • Yes, the IPW65R115CFD7AXKSA1 is qualified for automotive and high-reliability applications. However, it's essential to consult the device's AEC-Q101 qualification document and follow the recommended design and testing guidelines to ensure compliance with the required standards.
  • The device is designed to handle power cycling and thermal stress, but it's essential to follow the recommended guidelines for power cycling, thermal management, and derating to ensure the device's reliability and lifespan.

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IPW65R115CFD7AXKSA1 Overview

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