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IPZ40N04S5L-2R8 - Infineon

Description: MOSFET N-CHANNEL_30/40V

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IPZ40N04S5L-2R8 - Infineon PCB footprint - Other - Other - PG-TSDSON-8-33
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IPZ40N04S5L-2R8 - Infineon  - 3D model - Other - PG-TSDSON-8-33
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IPZ40N04S5L-2R8 Details

  • Manufacturer Part Number:

    IPZ40N04S5L-2R8

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    140 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    40 A

  • Drain-source On Resistance-Max:

    0.0038 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    160 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Element Material:

    SILICON

IPZ40N04S5L-2R8 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IPZ40N04S5L-2R8 is -55°C to 175°C, as specified in the datasheet. However, it's recommended to operate within a temperature range of -40°C to 150°C for optimal performance and reliability.
  • To ensure safe operating area (SOA) for IPZ40N04S5L-2R8, follow the guidelines provided in the datasheet, including voltage and current ratings, and thermal management. Additionally, consider factors like switching frequency, duty cycle, and PCB layout to prevent overheating and electrical overstress.
  • For optimal thermal management, use a PCB layout that provides good heat dissipation, such as using thermal vias, heat sinks, and thermal pads. Ensure that the MOSFET is mounted on a copper plane or a thermal pad to dissipate heat efficiently. Follow the recommended land pattern and thermal design guidelines provided in the datasheet or application notes.
  • Yes, IPZ40N04S5L-2R8 is suitable for high-frequency switching applications up to 1 MHz. However, consider the MOSFET's switching characteristics, such as rise and fall times, and ensure that the application's switching frequency and duty cycle are within the recommended specifications.
  • When selecting a gate driver for IPZ40N04S5L-2R8, consider factors like the driver's output current, voltage rating, and rise/fall times. Ensure that the gate driver can provide a sufficient current to charge and discharge the MOSFET's gate capacitance quickly, and that the driver's voltage rating is compatible with the MOSFET's gate-source voltage rating.

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IPZ40N04S5L-2R8 Overview

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