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IPZ65R019C7 - Infineon

Description: MOSFET N-Ch 700V 75A TO247-4

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IPZ65R019C7 - Infineon  - 3D model
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IPZ65R019C7 Details

  • Manufacturer Part Number:

    IPZ65R019C7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247

  • Package Description:

    GREEN, PLASTIC PACKAGE-4

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    583 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    75 A

  • Drain-source On Resistance-Max:

    0.019 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    496 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPZ65R019C7 Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area connected to the drain pin to dissipate heat efficiently. A minimum of 2 oz copper thickness and a thermal via array under the device are also recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, including a proper heat sink design, and to monitor the device's junction temperature (Tj) to prevent overheating.
  • Exceeding the maximum ratings can lead to permanent damage to the device, including reduced lifespan, increased leakage current, and even catastrophic failure. It's crucial to operate the device within the specified ratings to ensure reliable operation.
  • To protect the device from ESD, handle the device by the body, use an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, including the use of ESD protection diodes and resistors.
  • Infineon recommends using a gate drive circuit with a high current capability and a low output impedance to ensure fast switching times and minimal power loss. A dedicated gate driver IC or a discrete circuit with a low impedance output stage is recommended.

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IPZ65R019C7 Overview

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