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IR1150IPBF - Infineon

Description: PFC IC Continuous Conduction (CCM) 200kHz 8-PDIP

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PCB Footprints
IR1150IPBF - Infineon PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8 Lead PDIP
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IR1150IPBF - Infineon  - 3D model - Dual-In-Line Packages - 8 Lead PDIP
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IR1150IPBF Details

  • Manufacturer Part Number:

    IR1150IPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DIP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    15 V

  • Input Voltage-Nom:

    18 V

  • JESD-30 Code:

    R-PDIP-T8

  • Length:

    9.905 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current-Max:

    1.5 A

  • Output Voltage-Max:

    6.8 V

  • Output Voltage-Min:

    5.17 V

  • Output Voltage-Nom:

    6.15 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.33 mm

  • Supply Current-Max (Isup):

    40 mA

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    200 kHz

  • Temperature Grade:

    OTHER

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

IR1150IPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermistor or thermal sensor to monitor the device temperature.
  • Monitor the input voltage, output voltage, current, and temperature. Also, keep an eye on the device's power dissipation, especially during high-load conditions.
  • Use a voltage regulator or a voltage supervisor to regulate the input voltage. Add overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage from voltage transients.
  • Use ESD protection diodes or TVS diodes on the input and output pins. Ensure that the PCB design includes ESD protection features, such as guard rings and ESD-safe layout practices.

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