Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve thermal dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm to 0.5 mm is recommended.
To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and PCB layout. Additionally, consider using a thermistor or thermocouple to monitor the device temperature.
When selecting a heatsink for the IR11672ASPBF, consider the thermal resistance (Rth), heatsink material, and surface finish. A heatsink with a low thermal resistance (Rth < 5°C/W) and a surface finish that ensures good thermal contact with the device is recommended.
To troubleshoot OTP trips, check the device temperature, PCB thermal design, and heatsink performance. Verify that the thermal interface material is properly applied, and the heatsink is securely attached. Also, ensure that the device is not operating in an over-current or over-voltage condition.
Infineon recommends a soldering profile with a peak temperature of 260°C to 270°C, a dwell time of 30 seconds to 60 seconds, and a ramp-up rate of 1°C/s to 3°C/s. Refer to the Infineon application note for detailed soldering profile guidelines.
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