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IR11682SPBF - Infineon

Description: DUAL SmartRectifier DRIVER IC

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IR11682SPBF - Infineon PCB footprint - Other - Other - SOIC127P600X175-8N
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IR11682SPBF - Infineon  - 3D model - Other - SOIC127P600X175-8N
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IR11682SPBF Details

  • Manufacturer Part Number:

    IR11682SPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    60 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    8.6 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.12 µs

  • Turn-on Time:

    0.2 µs

  • Width:

    3.9 mm

IR11682SPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and follow the recommended thermal design guidelines. Also, consider using a thermal interface material (TIM) between the device and the heat sink.
  • The maximum allowed voltage on the VIN pin is 30V, but it's recommended to keep it below 28V to ensure reliable operation and to prevent damage to the device.
  • Use a fuse or a current limiter in series with the VIN pin to protect against overcurrent conditions. Also, consider using a voltage regulator or a TVS diode to protect against overvoltage conditions.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the VIN pin to filter out noise and ripple.

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