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IR11688STRPBF - Infineon

Description: AC/DC Converters CONTROLLER/GAN

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IR11688STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC-ren1
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IR11688STRPBF - Infineon  - 3D model - Small Outline Packages - 8 Lead SOIC-ren1
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IR11688STRPBF Details

  • Manufacturer Part Number:

    IR11688STRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

IR11688STRPBF Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve thermal dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm to 0.5 mm is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rated value.
  • Infineon recommends soldering the device using a reflow soldering process with a peak temperature of 260°C to 270°C for a maximum of 30 seconds. Hand soldering is not recommended due to the device's sensitive internal components.
  • To troubleshoot issues with the overcurrent protection feature, check the device's output current and voltage levels, and ensure that the input voltage is within the recommended range. Also, verify that the device is properly configured and that the overcurrent protection threshold is set correctly.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or use an ESD wrist strap or mat. Ensure that the device is stored in an ESD-protected environment, and use ESD-protected packaging during transportation and storage.

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