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IR2133JPBF - Infineon

Description: Infineon IR2133JPBF Hex Half Bridge MOSFET Power Driver, 500mA, 10 → 20 V, Non-Inverting, PLCC 44-Pin

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IR2133JPBF - Infineon - PCB symbol
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IR2133JPBF - Infineon PCB footprint - Other - Other - IR2133JPBF-2
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IR2133JPBF - Infineon - 3D model - Other - IR2133JPBF-2
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IR2133JPBF Details

  • Manufacturer Part Number:

    IR2133JPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    FLOATING LOAD DRIVER; UNDER VOLTAGE LOCKOUT CIRCUIT

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    S-PQCC-J32

  • JESD-609 Code:

    e3

  • Length:

    16.5862 mm

  • Number of Functions:

    3

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC44,.7SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.57 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    600 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.95 µs

  • Turn-on Time:

    1 µs

  • Width:

    16.5862 mm

IR2133JPBF Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the IR2133JPBF is 600 kHz, but it can be adjusted up to 1 MHz with an external oscillator.
  • Proper thermal management can be achieved by providing a heat sink, ensuring good airflow, and keeping the device away from heat sources. The thermal pad on the bottom of the package should be connected to a copper plane on the PCB to dissipate heat.
  • The recommended layout and routing for the IR2133JPBF involves keeping the high-current paths short and wide, using a solid ground plane, and minimizing the loop area of the high-frequency circuits. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The IR2133JPBF has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, additional protection can be achieved by using external voltage regulators, TVS diodes, and fuses to protect against voltage transients and surges.
  • The recommended input capacitance is 10-22 μF, and the recommended output capacitance is 10-47 μF. The capacitance values depend on the specific application and the desired level of filtering and decoupling.

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IR2133JPBF Overview

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