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IR2304PBF - Infineon

Description: Infineon IR2304PBF Dual MOSFET Power Driver, 130mA Half Bridge, 10 → 20 V 8-Pin, PDIP

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IR2304PBF - Infineon PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Lead PDIP
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IR2304PBF - Infineon  - 3D model - Dual-In-Line Packages - 8-Lead PDIP
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IR2304PBF Details

  • Manufacturer Part Number:

    IR2304PBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDIP-T8

  • Length:

    9.88 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.13 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.33 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.33 µs

  • Turn-on Time:

    0.32 µs

  • Width:

    7.62 mm

IR2304PBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IR2304PBF is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance and reliability.
  • Proper thermal management is crucial for the IR2304PBF. Ensure good thermal conductivity between the device and the heat sink, use a thermal interface material (TIM) if necessary, and provide adequate airflow around the device. The datasheet provides thermal resistance values to help with thermal design.
  • The IR2304PBF requires careful PCB layout and design considerations to minimize electromagnetic interference (EMI) and ensure proper operation. Keep the high-frequency nodes (e.g., bootstrap capacitor) close to the device, use a solid ground plane, and avoid routing high-current traces near sensitive nodes. The datasheet provides guidelines for PCB layout and design.
  • The bootstrap capacitor selection depends on the specific application requirements, such as the switching frequency, output voltage, and current. A general guideline is to choose a capacitor with a value between 10nF to 100nF, with a voltage rating higher than the output voltage. The datasheet provides more detailed guidance on bootstrap capacitor selection.
  • To minimize EMI, use a combination of filtering and shielding techniques. Add EMI filters (e.g., LC filters) to the input and output stages, and ensure proper shielding of the device and surrounding components. The datasheet provides guidance on EMI filtering and shielding, and Infineon also offers application notes and design guides for EMI mitigation.

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