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IR2308STRPBF - Infineon

Description: Driver 600V 0.35A 2-OUT High and Low Side Half Brdg Non-Inv 8-Pin SOIC N T/R

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PCB Footprints
IR2308STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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3D Models
IR2308STRPBF - Infineon  - 3D model - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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IR2308STRPBF Details

  • Manufacturer Part Number:

    IR2308STRPBF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MS-012AA, SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.75

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.35 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.28 µs

  • Turn-on Time:

    0.3 µs

  • Width:

    3.9 mm

IR2308STRPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IR2308STRPBF is -40°C to 150°C, with a junction temperature of up to 175°C.
  • Proper thermal management for the IR2308STRPBF can be achieved by providing a heat sink, ensuring good airflow, and keeping the device away from heat sources. The thermal resistance of the package is also important to consider.
  • The recommended PCB layout for the IR2308STRPBF involves keeping the high-frequency nodes (e.g. bootstrap capacitor) close to the device, using a solid ground plane, and minimizing the length of the high-current paths.
  • To troubleshoot issues with the IR2308STRPBF, check the input voltage, output current, and temperature. Verify that the device is properly configured and that the PCB layout is correct. Use an oscilloscope to monitor the device's behavior and identify any anomalies.
  • Yes, the IR2308STRPBF is suitable for high-reliability and safety-critical applications, such as automotive, industrial, and medical devices. However, it is essential to follow proper design and testing procedures to ensure the device meets the required safety and reliability standards.

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IR2308STRPBF Overview

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